Series Seed · Semiconductor Disruption · Edge Software Inc.

THE $400B
MACHINE
IN A BOX.

ASML's EUV lithography system costs $400,000,000, weighs a school bus, and has an 18-month waitlist. EdgeLitho replaces it with a 12"×12"×12" desktop machine running on a wall outlet for under $50,000. Same result. 8,000× cheaper. Ships FedEx.

$400M→ $50K machine cost
180Tkg → 20kg weight
18mo→ ships same week
$400B
Total Market
Semiconductor equipment
1
Current Supplier
ASML holds monopoly
3
Revenue Streams
Machine · Wafer · Software
4
Patents Filed
April 11, 2026
The Problem

CHIP MANUFACTURING
IS HELD HOSTAGE.

Every advanced chip on Earth — in your phone, your car, your server rack — requires a machine made by one company: ASML. Their EUV lithography system is the single most complex machine humans have ever built. It is also the single most dangerous supply chain bottleneck in the global economy.

The result: only 3 companies on Earth can manufacture leading-edge chips, because only they can afford the machine, the facility to house it, the power to run it, and the 200+ PhD engineers to operate it. Every other nation, university, startup, and defense contractor is locked out.

Metric ASML EUV Reality
Purchase price$400,000,000Per unit
Machine weight180,000 kgSchool bus
Power drawDedicated substationMW-class
Delivery wait18 monthsGeopolitical risk
Operators neededPhD engineersSpecialized team
Who can afford it3 companiesTSMC, Samsung, Intel
Light sourceTin plasma @ 50k/sec5% efficiency
Mirror losses67% per mirror × 10Compounding waste
CORE INEFFICIENCY
The EUV machine generates light the hardest possible way, then loses 95% of it fighting the properties of light itself. It is a workaround on top of a workaround — optimized for the 1970s process it was designed to improve.
The Solution

DON'T FIGHT THE
PHYSICS. REDESIGN IT.

EdgeLitho inverts the problem. Instead of building an increasingly complex machine to write on an increasingly dumb substrate — we made the substrate smart and the machine simple.

// Conventional approach
Machine → writes pattern → dumb wafer
// 50+ external process steps follow

// EdgeLitho approach
Machine → triggers chemistry → smart wafer
// Wafer executes its own fabrication
// Zero external process steps

The Two Inventions

WATS Wavelength Addressed Trigger System — a 12"×12"×12" machine that fires specific wavelengths of light at a pre-loaded wafer. Each wavelength activates a different chemistry layer. No vacuum. No plasma. Wall outlet power.
LPCS Latent Pre-loaded Chemistry Stack — a wafer where every chemical needed to build a chip is already embedded in spatial zones, staged in activation order, with intentional bleed compensation designed in.
MetricASML EUVEdgeLitho WATS
Machine cost$400,000,000~$50,000
Machine sizeSchool busMicrowave oven
PowerMW substation110V wall outlet
Weight180,000 kg~20 kg
OperatorsPhD teamTrained technician
Light sourceTin plasmaSolid-state lasers
Vacuum requiredYes — entire systemNo
Delivery18 monthsShips FedEx
Who can use it3 companiesAnyone
The Platform

ONE CHASSIS.
TWO MACHINES.

The EdgeWriter and WATS share identical hardware — same photon sail stage, same DMD optics, same controller, same enclosure. Swap the head. Different job. This is the razor-and-blade model applied to semiconductor manufacturing.

EdgeWriter

Deposits pre-loaded chemistry zones onto blank silicon wafers. Reads a chemistry blueprint file from EdgeEDA. Produces LPCS wafers.
DEPOSITION HEAD
Nano-inkjet · Microfluidic · Vapor
SOLD TO → Wafer foundries · Research labs · Defense contractors

WATS Machine

Fires wavelength-specific triggers at LPCS wafers. Each wavelength activates one chemistry layer. Produces finished chips. No external process steps.
LASER TRIGGER HEAD
8-channel · DMD patterned
SOLD TO → Chip manufacturers · Universities · DoD · Startups

Photon Sail Stage

4 wavelength-selective reflective sails. All lasers always on. Movement via controlled imbalance — like driving with one foot always on the brake. Sub-nanometer positioning. Zero friction.

Air Bearing Float

Carbon fiber + Zerodur puck (~10g) floats on nitrogen film 5–10µm above base plate. UV-transparent top surface. No contact, no friction, no particles. Cleanroom Class 1.

DMD + Microlens

TI DLP991UUV — 8.9M mirrors, 110Gpx/s. Microlens array beneath DMD focuses each mirror's beam to diffraction-limited spot. Mirror imperfection irrelevant — lens sets the precision.
The LPCS Wafer

THE WAFER IS
THE PROGRAM.

Every chemistry needed to build a chip is pre-loaded into the wafer in spatial zones — laid out like a blueprint. The circuit design is expressed as chemistry placement, not geometry. The WATS machine just pulls the trigger.

Zoned Chemistry Architecture

Zone isolation — chemistry separated in space, not just spectrally. Each zone contains only its required chemistry. Crosstalk only occurs at designed boundary zones.

Intentional bleed — boundary zones are pre-calculated transition chemistry. Bleed is designed in, not corrected for. The gradient IS the feature.

Melt sequencing — when layers 5–8 must melt into each other, chemicals are staged in activation order within the stack. Chemistry is the fuse. Order is the program.
// LPCS Zone Map — 12×12 grid
Zone A1–C2: Gate oxide chemistry (GX)
Zone D1–F2: Metal interconnect (MX)
Zone G1–I2: Isolation layer (IX)
Zone C3: ← Transition: GX→MX bleed
Zone A3–C4: N-type dopant (NX)
// Vertical stack within each zone:
Layer order: bottom→top = activation sequence
LPCS WAFER — ZONE MAP (12×12)
GX Gate
MX Metal
IX Isolate
NX N-type
PX P-type
OX Oxide
TX Transition
Science basis: Wavelength-selective caged photochemistry is established science. 4 independently addressable layers have been demonstrated in published research (JACS 2011). EdgeLitho extends this to 8+ layers using spatial zone separation — a novel architecture that transforms the chemistry problem from "spectral isolation" to "spatial isolation."
Market Opportunity

WE DON'T NEED
THE WHOLE MARKET.

ASML targets the top 3 companies making bleeding-edge AI chips. EdgeLitho targets everyone else — the 90% of chips that don't need 3nm. Power semiconductors. RF chips. MEMS sensors. Defense ICs. University research. Medical devices. That's a $360B+ addressable market with zero current competition at our price point.

$400B
Total Semiconductor Equipment
2025 global market
$360B
Our Addressable Market
Mature node + research + defense
$50K
Our Machine Price
vs $400M for EUV
8,000×
Cost Advantage
Same output node

Who Buys First

Defense / DoD
Cannot wait 18 months. Cannot depend on foreign supply chains. Will pay premium for sovereign chip capability.
Universities
Zero access to EUV today. $50K is a research grant, not a capital campaign. Every major engineering school is a customer.
Startup Fabs
New entrants locked out of the market entirely. EdgeLitho is their entry ticket.
Mature Node Fabs
90nm–130nm chips: automotive, industrial, medical. No need for EUV. Current tools aging out.
National Labs
DARPA, Sandia, Los Alamos. Classified chip programs that can't use commercial fabs.
Competitive Moat

FOUR WALLS.
NO WAY THROUGH.

The patent architecture creates a closed ecosystem. To make chips with this system, you must license both the machine and the wafer from the same inventor. There is no path through. There is no path around.

WATS Machine (EDGE-2026-004B)
Cannot function without LPCS wafers. Delivers no processing function to conventional substrates. Necessarily requires LPCS architecture.
LPCS Wafer (EDGE-2026-004A)
Cannot be processed by any conventional lithographic, EUV, or e-beam system. Necessarily requires WATS machine. No functional substitute exists.
Zoned Chemistry Architecture (New)
Spatial zone isolation. Intentional bleed compensation. Melt sequencing. Chemistry-as-program. Novel — nothing like it in literature or practice.
Photon Sail Positioning (EDGE-2026-004B)
4-axis wavelength-selective sail system. Continuous opposing tension. Photon cage locking. Sub-nanometer positioning with zero mechanical contact.

The Legal Wall

LPCS Wafer (004A) "Cannot function without WATS machine"inseparable WATS Machine (004B) "Cannot function without LPCS wafer" RESULT: To make chips with this system you must license BOTH patents from the SAME inventor. No path through. No path around. No designing out of it.

EdgeEDA Software Moat

EdgeEDA converts chip designs to chemistry zone maps. Nobody can use the hardware without the software. Nobody can write the software without the chemistry knowledge. Nobody has the chemistry knowledge without the patents. The software is the third lock on the vault.

Filed April 11, 2026

App #64/036,120 Conf #6763 Expires Apr 2027
Consolidated provisional covers: EdgePhone, EdgeSmartCell, EdgeGuardian, EdgeSeal, EdgeDefend, EdgeRing PCB, EdgeChip E1, EdgeMedic, WATS, LPCS, EdgeWriter.
Roadmap

THREE PHASES.
ONE PLATFORM.

Phase 1
0–12 mo
Machine Proof of Concept — ~$50K
Build WATS prototype. Prove photon sail positioning, DMD patterning, wavelength delivery, inline inspection. Pattern at 100µm features with conventional resist — visible, demoable, investor-ready. No chemistry required yet.
Phase 2
12–24 mo
2-Layer LPCS Wafer — Chemistry Partnership
Partner with MIT, Stanford, or specialty chemical company. 2-layer wavelength-selective stack is already demonstrated in published science. 2 layers proven = Series A. EdgeWriter prototype built alongside.
Phase 3
24–48 mo
Full 8-Layer LPCS + Commercial Platform
Scale to 8 chemistry layers. First commercial WATS + EdgeWriter units. EdgeEDA software platform. LPCS wafer as recurring consumable revenue. Target: first 10 university + defense customers.
Phase 4
48 mo+
Platform Scale — The $400B Disruption
Volume production. Licensing to foundries. LPCS wafer as high-margin consumable. SBIR/STTR government contracts. The semiconductor equipment market democratized.

Revenue Model

01
EdgeWriter Machine
Sold to wafer foundries and research labs. Deposits LPCS chemistry onto blank silicon. One-time capital sale plus service contracts.
~$50K per unit
02
WATS Machine
Sold to chip manufacturers, universities, defense. Processes LPCS wafers into finished chips. One-time capital sale plus service.
~$50K per unit
03
LPCS Wafers — The Razor Blade
Every chip run consumes wafers. Recurring, high-margin consumable revenue. Cannot be sourced elsewhere — patented architecture. Grows with customer base forever.
Recurring · High margin · Locked in
04
EdgeEDA Software
Converts chip designs to chemistry zone maps. Required to use the hardware. Subscription or per-design licensing. No software = no chips.
SaaS · Per-design · Platform lock
The Ask

SEED ROUND.
LET'S BUILD IT.

$2M
Seed Round Target
Open
WATS prototype hardware + lab setup $800K
Chemistry R&D — 2-layer LPCS partnership $400K
EdgeEDA software development $300K
IP continuation filings + legal $250K
Team — first 2 hires (hardware + chemistry) $150K
Operations — 18 months runway $100K

What $2M Proves

A working WATS machine patterning real features. A 2-layer LPCS wafer demonstrating wavelength-selective chemistry activation. An EdgeEDA file that generates the chemistry blueprint. Live investor demo of the complete pipeline — design to chip — in a box on a table.

That's Series A territory.

Why Now

Geopolitical: ASML is a Dutch company. Taiwan Strait risk is existential for global chip supply. Every government on Earth is trying to build sovereign semiconductor capability. EdgeLitho is the only path that doesn't require $50B fabs.

Technical: The caged photochemistry science is mature. The machine components are all commercial. The photon sail positioning works at zero friction. Everything needed to build Phase 1 exists today.

IP: Filed April 11, 2026. Priority date is locked. Window to build before someone else figures this out is now.

The Founder

Daryll Clint Anderson — Edge Software, Vista CA.
40-year construction career. 5 months of coding. Zero semiconductor background. In one session: identified the core inefficiency of EUV lithography from first principles, invented the pre-loaded chemistry wafer, designed the photon sail positioning system, and filed 4 provisional patents in a single morning.

Critical thinking is the only credential that matters for paradigm shifts.
CONTACT
Edge Software Inc. · Vista, CA
Patent App #64/036,120 · Conf #6763
EDGE
SOFTWARE